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Specification

Honor Pad X8b

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Display
Display TypeTFT LCD, 90Hz, 500 nits
Display Size11.0 inches, 347.5 cm² (~80.3% screen-to-body ratio)
Display Resolution1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
Display ProtectionNot recorded
Performance & memory
OSAndroid 16, MagicOS 10
ChipsetQualcomm SM6225 Snapdragon 680 4G (6 nm)
CPUOcta-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
GPUAdreno 610
Internal Memory64GB 4GB RAM, 128GB 4GB RAM, 128GB 6GB RAM, 256GB 6GB RAM, 256GB 8GB RAM
Storage technologyNot recorded
Memory Card SlotmicroSDXC
Cameras
Main Camera5 MP, f/2.0, AF
Main Camera FeaturesHDR
Main Camera Video1080p@30fps
Selfie Camera5 MP, f/2.0
Selfie Camera FeaturesNot recorded
Selfie Camera Video1080p@30fps
Battery & charging
Battery TypeLi-Ion 10100 mAh
Battery ChargingNot recorded
Connectivity
Network TechnologyGSM / HSPA / LTE
Network speedHSPA, LTE - cellular model only
WLANWi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth5.0, A2DP, LE
GPSNo
NFCNo
USBUSB Type-C, OTG
RadioNo
Build & availability
Launch2026, February 13
StatusAvailable. Released 2026, February 13
Body Dimension256.9 x 168.5 x 7.3 mm (10.11 x 6.63 x 0.29 in)
Body Weight496 g (1.09 lb)
Body BuildGlass front, aluminum frame, aluminum back
Body SIMNano-SIM
Water/dust resistanceNot recorded
Other body featuresNot recorded
ColorsSpace Gray
ModelsNDL2-W09
Features & sound
Sensorsaccelerometer
Additional featuresNot recorded
LoudSpeakerYes, with stereo speakers (4 speakers)
3_5mm Speaker jackNo
Audio features24-bit/192kHz Hi-Res & Hi-Res Wireless audio

Missing information means “Not recorded,” not absence of a feature. A57 specifications await verification.

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